1900/65A Terminal Connection Digital Module

The establishment of 1900/65A wired communications must be set up cable, or digging cable trench, so it requires a lot of manpower and material resources; while the establishment of a dedicated wireless data transmission with wireless digital transmission radio does not need to set up cables or digging cable trench, only need to be connected to the wireless digital transmission radio in each terminal and set up the appropriate height of the antenna can be. Compared with the wireless data transmission module to establish a dedicated wireless data transmission method, saving labor and material resources, the investment is quite economical.

1900/65A The opposite is true in copper-free substrates and in modules with solderless pressure contact. In SKiM, a newly developed pressure system based on laminated busbars presses the substrate with the chips directly onto the heat sink. Since each IGBT and diode chip has its own connection to the main terminals, the current distribution between the parallel chips is very homogeneous and the package resistance RCC’+EE’ is small. the large area of the connection between the DBC substrate and the heat sink is not soldered, and the substrate can be “moved” almost without restriction on the heat sink depending on the temperature cycling reliability. The large area connection between the DBC substrate and the heat sink is not soldered.

1900/65A As a solution to this problem, SEMIKRON developed SKiiP technology, a bottomless crimping system, more than 15 years ago. This system completely eliminates large solder connections and replaces them with pressure connections. Currently, SKiiP technology has been further improved for the new SKiM automotive module concept to ensure an efficient, reliable and durable module.SKiM is designed to meet the stringent requirements of high power densities and harsh environmental conditions in automotive applications.