1X00781H01L Standalone Chip


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1X00781H01L Standalone Chip

The standalone CAN chip of 1X00781H01L is SJA1000, and the 8-bit microcontrollers with CAN controller are P8xC591 and so on, but the CAN controller integrated in TMS320LF2407 is very characteristic. It has six mailboxes, of which there are two sending mailboxes, two receiving mailboxes, two send/receive optional mailboxes; each sending mailbox has an independent send identification code, each receiving mailbox has an independent receive acceptance code, and each of the two receiving mailboxes share a common receive shield code.

1X00781H01L’s multiple mailbox arrangement than the SJA1000 equivalent to only two mailboxes (a receiving mailbox / a sending mailbox), which greatly facilitates the user to construct a more complex network, to achieve more flexible communication. It also simplifies the writing of communication protocol. Since the CAN protocol does not specify the assignment of message identifiers, different methods can be used depending on the application. Therefore, when designing a CAN-based communication system, it is very important to determine the assignment of CAN identifiers, which is the main element of the application layer protocol.

1X00781H01L communication protocol is only two layers: the physical layer and the data link layer, the essential application layer protocols left to the secondary developers to choose or design. The more common application layer protocols are CANopen, DeviceNet and SDS, of which CANopen is more popular in Europe, while DeviceNet and SDS are more common in the United States. Our specialised application layer protocols are tailor-made. Physical layer protocols are responsible for physical signal transmission, decoding, bit timing, bit synchronisation, etc.; data link layer protocols are responsible for bus arbitration, message framing, data validation, error detection, flow control, etc.; application layer protocols are mainly responsible for the allocation of identifiers, followed by network startup or monitoring node handling, etc.