CC-PAON01 51410070-175 High Speed Proficient Positioning System

CC-PAON01 51410070-175

Technical Parameters:

  • Full lineup of 36 discrete, analog and specialty PAC I/O modules
  • Local, Expansion and Remote I/O bases, up to 115,000+ I/O points
  • Auto-discover local and remote PAC bases, I/O and GS drives
  • Hot-swappable I/O, No module placement restrictions, No power budget limitations
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Simon Zhang
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CC-PAON01 51410070-175 High Speed Proficient Positioning System

CC-PAON01 51410070-175 requires a high degree of precision in the production and processing requirements, in modern daily life, many daily electronic products are particularly fast, used in the development of research and development, production cycle is particularly short, and in this link, the production link is particularly important, so on the requirements of the production equipment is also more and more high, the production equipment should be able to adapt to a wide range of different product Production equipment should be able to adapt to a variety of different products, especially the ability to adapt to the production of new products, but also to ensure the accuracy of the product.

CC-PAON01 51410070-175 in the TFT production, in the substrate to complete the circuit printing and a series of other work after a process, is the cutting of the substrate, because in the former production according to the requirements of the equipment and process is a relatively large substrate, in a large substrate may have a number of small substrate composition, which is based on the use of manufacturing panels themselves to determine. Such as mobile phone panels, currently in the production of a large substrate has 30 to 104 pieces of small substrate composition, which is also based on the size of the mobile phone panel to determine.

CC-PAON01 51410070-175 is cut and turned into one piece of small substrate, as shown in Figure 2. As can be seen from Figure 2, the substrate is composed of two layers of glass combined, between the two layers of printed circuits, and in the cutting of the upper and lower is not on a line, but into a ladder, in the TFT surface of the A printed circuit terminals, cut off in the process of absolutely can not be touched the terminals. A-F in the five dimensions of the accuracy to reach ± 0.1mm, and cut off the edges in the substrate can not have a rough edge