CI867K01 3BSE043660R1 High Speed Proficient Positioning System

CI867K01 3BSE043660R1 requires a high degree of precision in production and processing requirements, in modern daily life, many daily electronic products are particularly fast, used in the research and development, production cycle is particularly short, and in this link, the production link is particularly important, so on the requirements of the production equipment is also more and more high, the production equipment should be able to adapt to a wide range of different product Production equipment should be able to adapt to the production of a variety of different products, especially the production of new products to adapt to the ability, but also to ensure the accuracy of the product.

CI867K01 3BSE043660R1 in the TFT production, in the substrate to complete the circuit printing and a series of other work after a process, is the substrate cutting, because in the former production according to the requirements of the equipment and process is a relatively large substrate, in a large substrate may be composed of a number of small substrate, which is based on the manufacture of the panel itself to determine the purpose. Such as mobile phone panels, currently in the production of a large substrate has 30 to 104 pieces of small substrate composition, which is also based on the size of the mobile phone panel to determine.

CI867K01 3BSE043660R1 after cutting, into a piece of a small substrate, as shown in Figure 2. CI867K01 3BSE043660R1 can be seen, the substrate consists of a combination of two layers of glass, there is a printed circuit between the two layers, and the top and bottom of the cut is not in a line, but into a ladder shape, in the TFT side of the A place has Printed circuit terminals, cut off the process absolutely can not touch the terminals, A-F in the five dimensions of the accuracy to reach ± 0.1mm, and cut off the edge of the substrate can not have burrs!