DS200TCEBG1ACE New Power Electronics Modules


Technical Parameters:

  • CPU with 7 communication ports and LCD display
  • Serial ports for master/slave or custom device connections
  • USB local I/O expansion, Ethernet remote I/O
  • Plenty of discrete and analog I/O modules, display on analog modules
  • Easy drive integration
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DS200TCEBG1ACE New Power Electronics Modules

The DS200TCEBG1ACE is optimised by reducing the on-state voltage drop, however, because of its very high switching losses, it only makes sense to use this module for applications with low switching frequencies. In contrast, ultra-fast modules have been developed for applications with high switching frequencies. These IGBT modules are ideal for resonant switching converters due to their low tail current. In addition, the new generation of power integrated modules offers higher power density and efficiency without changing the module size.

The size of DS200TCEBG1ACE power converters no longer depends on the size of the power semiconductor module, but is determined by passive components such as capacitors, inductors and filters. This phenomenon is particularly true for low-power drives, as can be seen in (1) a study by ECPE (European Centre for Power Electronics). For modern drives below the 2.2kW range, the power semiconductor module package takes up only 6% of the overall device volume, which is roughly equivalent to the volume occupied by the cable terminals, the capacitor bank of the DC link takes up about 12% of the volume, which is twice as much as the power devices, and the component that takes up the most space is the control circuit board (about 23% of the volume), since it contains not only the drive and control circuits, but also the power supply units and EMI filters.

The size of DS200TCEBG1ACE power devices no longer depends on the area occupied by the semiconductor chip, but on the main circuit terminals. It is therefore unrealistic to expect that the size of a power electronics module can be reduced to the same extent as the size of the chip. Furthermore, in the presence of vibrations, large cable cross-sections and DC bus bar rows place relatively high stress on the module, and these factors can even have a negative effect on the reliability of the connected components. Therefore, stress relief elements in the design of power converters as well as additional mechanical reinforcement elements in the DC circuit links also play an important role.