DS200TCQCG1BGF Multi-layer Driver Circuit Boards


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DS200TCQCG1BGF Multi-layer Driver Circuit Boards

DS200TCQCG1BGF In forced air-cooled systems, it is usually unlikely that the maximum power of the module will be utilised because of reliability, as we do not recommend that users increase the temperature of the heat sink. Therefore, in order to make the best use of the heat sink, it is necessary to disperse the heat source and thus avoid hot spots. With the introduction of the SEMiX® module, SEMIKRON proposes a new benchmark for the use of individual half-bridge modules in the power components instead of a monolithically integrated six-tube package module.

When forced air cooling is used in the DS200TCQCG1BGF, the modules can be installed at intervals. Due to the corresponding heat transfer effect, the temperature of the module substrate is much lower and thus the output power can be increased. The positive effect of heat propagation is illustrated in Figure 3, where the maximum heat sink temperature is reduced from 96°C to 91°C if the modules are mounted spaced on the heat sink.It is of course also possible to replace the half-bridge module with an integrated six-tube package module, in which case, if water cooling is used, a compact solution with higher power density can be realised with the DS200TCQCG1BGF.

The DS200TCQCG1BGF is driven by greater integration (driver circuitry and passive components) and double-sided heat dissipation technology for the module chips. Due to the use of multilayer circuit boards, metallised devices, solder packs and even curved circuit boards connectivity technology has advanced dramatically. There are too many inconsistencies in the different models and connection technologies, with the result that customers have difficulty in manufacturing a wide range of converter families with consistent performance based on standard components and modules.