EI813F 3BDH000022R1 Controller CPU System

EI813F 3BDH000022R1

Technical Parameters:

  • Full lineup of 36 discrete, analog and specialty PAC I/O modules
  • Local, Expansion and Remote I/O bases, up to 115,000+ I/O points
  • Auto-discover local and remote PAC bases, I/O and GS drives
  • Hot-swappable I/O, No module placement restrictions, No power budget limitations
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Simon Zhang
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EI813F 3BDH000022R1 Controller CPU System

The EI813F 3BDH000022R1 embodies more thorough decentralisation, so that even the failure of any one front-end does not affect the normal operation of the others. Flexibility in field installation, with the ability to install sensors and actuators in close proximity to each other, saving on wiring and the number of IO points on the PLC itself. High-speed data transmission is provided for reliable communication between the controller CPU and the I/O system. Moreover, the field level is thoroughly decentralised, while a large number of safety barriers, isolators, I/O modules, field cables and terminals are reduced, so the Distributed Remote IO Module greatly improves its maintenance performance.

EI813F 3BDH000022R1 has good compatibility, and expand the distributed IO system of other buses, can also help you more rationalisation of the management of your distributed remote devices, to achieve unlimited expansion, supporting software can be carried out on your system, configuration, debugging, diagnostic help. Distributed remote IO module adopts digital transmission, which greatly improves the anti-interference ability of the system. All these factors make the distributed remote IO module reliability has been improved.

The EI813F 3BDH000022R1 can power up to 300 watts of low-voltage ASICs from a nominal 100V power supply, and has been tested by Boeing not only for resistance to a total ionising dose of 50 krad, but also for resistance to single-event upsets. Immunity to single-event upsets is achieved through a redundant architecture, where two identical power modules with fault-tolerant control ICs are connected in parallel and packaged in a high-density SM-ChiP module.