EMG LID43.03 External Storage Devices


Technical Parameters:

  • User defined tag-based programming for descriptive I/O naming
  • Simple-to-use instructions and Easy math to eliminate complex ladder logic rungs
  • Application tools for quick access to setup, programming, debugging and PAC control
  • Task Manager for quick and easy prioritization of Ladder Logic code
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LID43.03 External Storage Devices

LID 43.03 molecular level (macrostructure) depends on the system topology. A large number of multiprocessor nodes can be connected to a large (thousands of processors) system via a SAN (“big bus” model) to support distributed integrated real-time systems for data acquisition, control and data processing applications.

The interconnection of LID 43.03 distributed systems is based on links, bridges, and switching modules (L-modules, B-modules, and S-modules). The cost of communication speed decreases faster than the cost of pins and board space. Traditional communication is based on buses, which limits the number of processors.

Weak interactions between LID43.03 processor modules are based on messaging (Ethernet). Intermediate interactions are based on external storage devices used in the cluster (disks, tapes). Strong interactions between processor cores are based on direct reads to distributed memory and are implemented on SCI, which also supports weak interactions between processor modules.Strong interactions for SCI include small packet transactions (packets sent and responded to with echoed separation).