IC754VSF12CTD High Performance Computer Module

The goal of the IC754VSF12CTD module is to reduce the impact of rapid CPU replacement by avoiding the need to centralise all functions on one card. In the past, Intel and AMD have been able to introduce a new CPU every six months, and the uncertainty of how long older CPUs will remain on the market has necessitated the use of modularity to ensure their long-term availability. Of course, the scalability that it has brings with it a number of different performance variants. Another focus is on reducing the complexity of I/O board design. When the number of layers required for I/O boards is significantly reduced, this makes PCB design less expensive.

The IC754VSF12CTD is built for embedded edge server applications and can even be used as a benchmark for the VITA specification under extreme conditions. Other module standards, such as Qseven and SMARC 2.0, although both support ARM-based application processors, are limited to low-power or small designs. The latest COM-HPC module standard specification has learnt a lesson from the past: from the outset, this high-performance embedded computer module standard was developed by PICMG to avoid as much as possible fierce competition between modules. A manufacturer-independent consortium is the ideal ecosystem for a third-generation module standard specification.