MVI56-PDPS Semiconductor Chip Heat Sinks


Technical Parameters:

  • CPU with 7 communication ports and LCD display
  • Serial ports for master/slave or custom device connections
  • USB local I/O expansion, Ethernet remote I/O
  • Plenty of discrete and analog I/O modules, display on analog modules
  • Easy drive integration
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Simon Zhang
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MVI56-PDPS Semiconductor Chip Heat Sinks

The MVI56-PDPS uses a token ring approach and a master-and-slave approach between the slaves. The token method of the master allows the station that gets the token to gain control of the bus within a pre-defined period of time. Data exchange between the master and the slaves requires that the slaves can be communicated with as quickly as possible and with the right to control the bus, and each master can send and request information from the slaves. This configuration provides the shortest bus cycle, the system is open, third-party systems can also be connected to the PROFIBUS-DP fieldbus, modular expansion can be carried out, can be suitable for a variety of production equipment size and requirements, to ensure a high degree of flexibility.

The PROFIBUS protocol basis of MVI56-PDPS is the network reference model of ISO/OSI. There are no layers 3 to 7 in PROFIBUS-DP. The direct data link image (DDLM) provides a layer 2 functional image for the user interface. The physical layer (layer 1) uses EIARS-485 twisted-pair or fibre-optic cables, and the HIEE300936R0001 UFC718AE01 HIEE300885R0001 PPC380AE01 connectors use 9-pin D-type sockets developed in accordance with the RS 485 standard. The data link layer (Layer 2) provides media access control functions, integrity checking of data, and transmission execution of a protocol called FDL using a hybrid media access protocol corresponding to DIN (E) 19245, which supports single- or multi-master systems, master or slave devices.

Advantages of the MVI56-PDPS module:
(1) Compact and space-saving design.
(2) Better heat transfer between semiconductor chip and heat sink due to very low thermal resistance.
(3) Very high reliability thanks to crimping technology (no solder layers).
(4) No size requirements for heat sinks.
(5) Easy to install: no special clamps or thermal grease required.