SD-98762 101-098762-001 Format Transfer Module

SD-98762 101-098762-001

Technical Parameters:

  • CPU with 7 communication ports and LCD display
  • Serial ports for master/slave or custom device connections
  • USB local I/O expansion, Ethernet remote I/O
  • Plenty of discrete and analog I/O modules, display on analog modules
  • Easy drive integration
Category:
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Description

SD-98762 101-098762-001 Format Transfer Module


The SD-98762 101-098762-001 module has two modes of use, one is the format transmission mode. The other is transparent transmission mode. Module transmission format can not be transparent and G200-type GPRS module and transparent transmission mode? In fact, the transparent transmission mode of the serial port and the serial port of the device to transmit data although no format, but the destination address of the data is implicitly specified. The destination address of the data is saved in the EEROM, which is read into the ROM after the module is powered up, and the module turns the unformatted data of the serial port into formatted data containing the destination address when sending data.

The destination address of the SD-98762 101-098762-001 will change in two situations, one situation is to use the destination address change instruction to change the destination address in the EEROM. In the other case, the module compares the original address of the received data with the destination address in ROM when the data is received electrically, and replaces the destination address in ROM with the source address of the received data if the two addresses are different.

SD-98762 101-098762-001 The opposite is true in copper-free substrates and in modules with solderless pressure contact. In SKiM, a newly developed pressure system based on laminated busbars presses the substrate with the chips directly onto the heat sink. Since each IGBT and diode chip has its own connection to the main terminals, the current distribution between the parallel chips is very homogeneous and the package resistance RCC’+EE’ is small. the large area of the connection between the DBC substrate and the heat sink is not soldered, and the substrate can be “moved” almost without restriction on the heat sink depending on the temperature cycling reliability. The large area connection between the DBC substrate and the heat sink is not soldered.

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