TK-PRS021 51404305-275 Controller CPU System

TK-PRS021 51404305-275

Technical Parameters:

  • High-performance CPU with 50Mb memory, fast scan time
  • Industry-leading 7 communications ports, including built-in local expansion and Ethernet remote I/O ports are standard on the CPU
  • USB Programming and USB Data Logging are resident on the CPU
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Simon Zhang
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Phone/Whatsapp/Skype/Wechat: +86 133 6590 9307

Description

TK-PRS021 51404305-275 Controller CPU System


TK-PRS021 51404305-275 does not affect the normal operation of other front-ends. Flexibility in field installation, with the ability to install sensors and actuators in close proximity to each other, saving on wiring and the number of IO points on the PLC itself. High-speed data transmission is provided for reliable communication between the controller CPU and the I/O system. Moreover, the field level is thoroughly decentralised, while a large number of safety barriers, isolators, I/O modules, field cables and terminals are reduced, so the Distributed Remote IO Module greatly improves its maintenance performance.

TK-PRS021 51404305-275 have good compatibility, and expand the distributed IO system of other buses, but also to help you more rationalisation of the management of your distributed remote devices, to achieve unlimited expansion, supporting software can be carried out on your system, configuration, debugging, diagnostic help. Distributed remote IO module adopts digital transmission, which greatly improves the anti-interference ability of the system. All these factors make the distributed remote IO module reliability has been improved.

The TK-PRS021 51404305-275 can power up to 300 watts of low-voltage ASICs from a nominal 100V power supply, and has been tested by Boeing to withstand not only a total ionising dose of 50 krad, but also single-event upsets. Immunity to single-event upsets is achieved through a redundant architecture, where two identical power modules with fault-tolerant control ICs are connected in parallel and packaged in a high-density SM-ChiP module.